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教授

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王凌云

姓名：王凌云

职称/职务：教授/博士生导师；厦门市双百人才，厦门市重点人才,厦门市微机电研究会副理事

研究方向：微纳制造技术与装备；MEMS器件设计与开发；传感器封装与集成关键技术等

办公地点：厦门大学翔安校区航空航天大楼223

邮箱：wangly@xmu.edu.cn

教育背景

2004/09-2009/12，厦门大学，机电工程系，硕博连读，获测试计量技术与仪器专业博士学位

1997/09-2001/07，厦门大学，机电工程系，获测控技术与仪器专业工学学士

教学工作

1.《电子技术》（本科生）

2.《机械工程测试技术基础》（本科生）

3.《传感器原理及应用》（本科生）

4.《微纳机电系统设计与工艺》（研究生）

5.《集成电路设计基础》（本科生）

6.《工业4.0与智能制造》（全校本科生大类通识课程）

研究领域

主要研究方向有：

1）MEMS器件设计及关键工艺开发；

2）MEMS器件集成封装及功能测试；

3）现代或极端环境用传感器开发设计及功能应用；

4）基于气浮、静电、压电喷射的微纳制造技术及装备开发；

5）高温薄膜传感器设计及其工艺开发。

近期发表文章

[1]Bu, Zhenxiang; Liu, Lujiang; Zhong, Changzhi; Wang, Shiqi; Gu, Dandan; Wang, Lingyun*. An Innovative LC-C Resonant Pressure Sensor Based on Capacitive Feedthroughs. IEEE Sensors Journal, 1530-437X, 2021-09-15.

[2]Yuchao Zhu; Lingke Yu; Dezhi Wu; Wenlong Lv; Lingyun Wang. A high-sensitivity graphene ammonia sensor via aerosol jet printing. Sensors and Actuators A Physical, 318 (2021) 112434.

[3]Lingyun Wang，Daner Chen，Heng Xiong，Yifang Liu. "Design and Optimization of Glass Frit Package Structure for Micro Pressure Switch." 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) IEEE, 2021.

[4]Yifang Liu，Hongbo Sang，Zhenxiang Bu，Yulong Zhang，Lingyun Wang*. "Influence of the Particle Size of Glass Powder on Sintering Characteristics in TGV Packaging." 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) IEEE, 2021.

[5]Huang, Xiang; Jin, Hang; Lin, Siying; Bu, Zhenxiang; Lin, Zhihong; Tu, Wenchang; Wang, Lingyun*; Adaptive electrofluid-actuated liquid lens, Optics Letters, 2020, 45(2)：331-334.

[6]Xiang Huang, Siying Lin, Zhenxiang Bu, Wang, Lingyun*. Research on nozzle and needle combination for high frequency piezostack-driven dispenser. International Journal of Adhesive and Adhesives , 2020:102453.

[7]Wang, Lingyun*; Huang, Xiang; Lin, Siying; Bu, Zhenxiang; Jin, Hang; Lin, Xiaolong; Lin, Zhihong; Xie, Peiqin; Design and experiment of a jetting dispenser with compact amplifying mechanism and low stress in piezostack, Journal of Intelligent Material Systems and Structures, 2020, 31(5):788-798.

[8]Siying, Lin; Xiang, Huang; Dandan, Gu; Wenlong, Lv; Lingyun, Wang*; Investigation on Nickel-Based Nano-Scaffold Getter With Induction Heating and Rapid Activation, IEEE Transactions on Nanotechnology, 2020, 19：67-70.

[9]Huang, Xiang; Lin, Xiaolong; Jin, Hang; Lin, Siying; Wang, Lingyun*; Effect of Enhanced Squeezing Needle Structure on the Jetting Performance of a Piezostack-Driven Dispenser, Micromachines, 2019, 10(12)：0-850.

[10]Bu, Z., Lin, S., Huang, X., Li, A., Wu, D., Zhao, Y., Luo Z., & Wang, L.*.. A novel piezostack-driven jetting dispenser with corner-filleted flexure hinge and high-frequency performance. Journal of Micromechanics & Microengineering, 2018，28(7)，075001.

[11]Wang, L., Du, X., Wang, L.*, Xu, Z., Zhang, C., & Gu, D. (2017). High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor. Sensors, 17(3), 599.

[12]Zhan, Z., Li, W., Yu, L., Wang, L.*, & Sun, D. (2017). Study of Thermal Electrical Modified Etching for Glass and Its Application in Structure Etching. Materials, 10(2), 158.

[13]Du, X., Wang, L., Li, A., Wang, L.*, & Sun, D*. (2017). High Accuracy Resonant Pressure Sensor With Balanced-Mass DETF Resonator and Twinborn Diaphragms. Journal of Microelectromechanical Systems, 26(1), 235-245.

[14]Li, A., Zhang, C., Wang, H., He, Y., Sun, D., Wang, L.*, ... & Gu, D*. (2017). Design of temperature-immunization system packaging for the resonant pressure sensor. Modern Physics Letters B, 31(08), 1750085.

[15]Mahmoodi, S., Guoqing, H., Wang, L., & Nourikhajavi, M. (2017). Two-dimensional spin coating technology and the effect of artificial gravity on film’s air-bubbling. Microsystem Technologies, 23(5), 1585-1594.

[16]Wu, D., Xiao, Z., Deng, L., Sun, Y., Tan, Q., Dong, L., Wang, L*, & Zhao, Y. (2016). Enhanced Deposition Uniformity via an Auxiliary Electrode in Massive Electrospinning. Nanomaterials, 6(7), 135.

[17]Yifang, L., Daner, C., Liwei, L., Gaofeng, Z., Jianyi, Z., Lingyun, W*., & Daoheng, S.* (2016). Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure. Journal of Micromechanics and Microengineering, 26(3), 035018.

[18]Luo, Z., Zheng, G., & Wang, L.* (2016). A Study on the Influence of the Nozzle Lead Angle on the Performance of Liquid Metal Electromagnetic Micro-Jetting. Micromachines, 7(12), 220.

[19]Zheng, C., Li, W., Li, A. L., Zhan, Z., Wang, L. Y*., & Sun, D. H. (2016). Design and Manufacturing of a Passive Pressure Sensor Based on LC Resonance. Micromachines, 7(5), 87.

[20]Du, X., Liu, Y., Li, A., Zhou, Z., Sun, D., & Wang, L*. (2016). Laterally Driven Resonant Pressure Sensor with Etched Silicon Dual Diaphragms and Combined Beams. Sensors, 16(2), 158